Sökning: WFRF:(Lu R. Q.)
> (2005-2009) >
Wafer-Level Via-Fir...
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Gutmann, R.J.
(författare)
Wafer-Level Via-First 3D Integration with Hybrid-Bonding of Cu/BCB Redistribution Layers
- Artikel/kapitelEngelska2005
Förlag, utgivningsår, omfång ...
Nummerbeteckningar
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LIBRIS-ID:oai:DiVA.org:kth-91420
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-91420URI
Kompletterande språkuppgifter
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Språk:engelska
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Sammanfattning på:engelska
Ingår i deldatabas
Klassifikation
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Ämneskategori:vet swepub-contenttype
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Ämneskategori:kon swepub-publicationtype
Anmärkningar
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QC 20120328
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Three-dimensional (3D) integration with through-die viasoffer improved electrical performance compared to edgeconnectedwire bonds in stacked-die assemblies for wirelessapplications. Monolithic wafer-level 3D integration offersthe potential for a high density of micron-sized through-dievias necessary for highest performance memory stacks,microprocessors with large L2 caches and ASICs with largeembedded memories. In addition, such wafer-leveltechnologies offer the potential of lowest cost in largemanufacturing volume of any heterogeneous integrationplatform, incorporating the inherent low cost of monolithicIC interconnectivity. After a brief summary of current wafer-level 3D integrationplatforms, a recently introduced platform that offers theprocess integration advantage of copper-to-copper (Cu-to-Cu) bonding with the increased adhesion strength andenvironmental robustness of dielectric adhesive bondingusing benzocyclobutene (BCB) is discussed. Criticalprocessing challenges of the new platform include BCBpartial curing compatible with damascene patterning, postdamascene-patterning cleaning and surface activation,bonding process parameters, and wafer-level planarizationrequirements. The inherent incorporation of a redistributionlayer into the bonding layer process further reduces theprocess flow and is compatible with wafer-level packaging(WLP) technologies.
Ämnesord och genrebeteckningar
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3D
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high-density interconnect
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wafer-level
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redistribution layers
Biuppslag (personer, institutioner, konferenser, titlar ...)
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McMahon, J. J.
(författare)
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Rao, S.
(författare)
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Niklaus, FrankCenter for Integrated Electronics Rensselaer Polytechnic Institute Troy, New York, U.S.A.(Swepub:kth)u1bcu8r2
(författare)
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Lu, J. Q.
(författare)
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Center for Integrated Electronics Rensselaer Polytechnic Institute Troy, New York, U.S.A.
(creator_code:org_t)
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