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- Prochazka, LukasUniv Zurich, Switzerland (author)
Novel Fabrication Technology for Clamped Micron-Thick Titanium Diaphragms Used for the Packaging of an Implantable MEMS Acoustic Transducer
- Article/chapterEnglish2022
Publisher, publication year, extent ...
- 2021-12-31
- MDPI,2022
- electronicrdacarrier
Numbers
- LIBRIS-ID:oai:DiVA.org:liu-182647
- https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-182647URI
- https://doi.org/10.3390/mi13010074DOI
Supplementary language notes
- Language:English
- Summary in:English
Part of subdatabase
- SwePubSwePub
Classification
Notes
- Micro-Electro-Mechanical Systems (MEMS) acoustic transducers are highly sophisticated devices with high sensing performance, small size, and low power consumption. To be applied in an implantable medical device, they require a customized packaging solution with a protecting shell, usually made from titanium (Ti), to fulfill biocompatibility and hermeticity requirements. To allow acoustic sound to be transferred between the surroundings and the hermetically sealed MEMS transducer, a compliant diaphragm element needs to be integrated into the protecting enclosure. In this paper, we present a novel fabrication technology for clamped micron-thick Ti diaphragms that can be applied on arbitrary 3D substrate geometry and hence directly integrated into the packaging structure. Stiffness measurements on various diaphragm samples illustrate that the technology enables a significant reduction of residual stress in the diaphragm developed during its deposition on a polymer sacrificial material.
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Annan elektroteknik och elektronik hsv//swe
- ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
- implantable acoustic transducer; packaging; titanium; platinum multi-layer diaphragm; polymer sacrificial material; DC magnetron sputtering; intrinsic stress; stress measurement; stress relief
Added entries (persons, corporate bodies, meetings, titles ...)
- Huber, AlexanderUniv Zurich, Switzerland (author)
- Schneider, MichaelSwissNeutron AG, Switzerland (author)
- Ghafoor, NaureenLinköpings universitet,Tunnfilmsfysik,Tekniska fakulteten(Swepub:liu)naugh16 (author)
- Birch, JensLinköpings universitet,Tunnfilmsfysik,Tekniska fakulteten(Swepub:liu)jenbi91 (author)
- Pfiffner, FlurinUniv Zurich, Switzerland (author)
- Univ Zurich, SwitzerlandSwissNeutron AG, Switzerland (creator_code:org_t)
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- In:Micromachines: MDPI13:12072-666X
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