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  • Gällström, Andreas,1978-Linköpings universitet,Halvledarmaterial,Tekniska högskolan (author)

The Electronic Structure of the UD-4 defect in 4H, 6H and 15R SiC

  • Article/chapterEnglish2009

Publisher, publication year, extent ...

  • Trans Tech Publications,2009
  • printrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:liu-41968
  • https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-41968URI
  • https://doi.org/10.4028/www.scientific.net/MSF.600-603.397DOI

Supplementary language notes

  • Language:English
  • Summary in:English

Part of subdatabase

Classification

  • Subject category:ref swepub-contenttype
  • Subject category:kon swepub-publicationtype

Notes

  • The photoluminescence (PL) of the UD-4 defect is observed in semi-insulating bulk 4H, 6H and 15R SiC. In 4H and 6H SiC the UD-4 defect consists of two families of no-phonon (NP) lines, Ua and Ub, and in 15R SiC it consists of three families, Ua, Ub and U15R. The Ua family in 4H, 6H and 15R all show similar temperature behavior with higher energy NP lines becomming observable at higher temperatures. In the case of the Ub and U15R families, a luminescence line with lower energy than the prominent luminescence line appears at higher temperatures. The polarization and Zeeman measurements suggest that the defect has C3v symmetry.

Subject headings and genre

  • NATURAL SCIENCES
  • NATURVETENSKAP

Added entries (persons, corporate bodies, meetings, titles ...)

  • Magnusson, Björn,1970-Linköpings universitet,Halvledarmaterial,Tekniska högskolan(Swepub:liu)bjoma90 (author)
  • Thuaire, A.Linköpings universitet,Institutionen för fysik, kemi och biologi,Tekniska högskolan (author)
  • Henry, Anne,1959-Linköpings universitet,Tekniska högskolan,Halvledarmaterial(Swepub:liu)annhe32 (author)
  • Paskov, Plamen,1959-Linköpings universitet,Halvledarmaterial,Tekniska högskolan(Swepub:liu)plapa31 (author)
  • Janzén, Erik,1954-Linköpings universitet,Halvledarmaterial,Tekniska högskolan(Swepub:liu)erija14 (author)
  • Linköpings universitetHalvledarmaterial (creator_code:org_t)

Related titles

  • In:Materials Science Forum, Vols. 600-603: Trans Tech Publications, s. 397-400

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