ORMOCER (R) S - Inorganic-organic hybrid materials for e/o-interconnection-technology

Popall, M (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Dabek, A (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Robertsson, ME (författare)

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Valizadeh, S (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Hagel, OJ (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Buestrich, R (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Nagel, R (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Cergel, L (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Lambert, D (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

Schaub, M (författare)

Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany

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 (creator_code:org_t)

2000

2000

Engelska.

Ingår i: Molecular Crystals and Liquid Crystals Science and Technology. - 1058-725X. ; 354, s. 711-730

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