On the deposition rate in a high power pulsed magnetron sputtering discharge

• The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density I-Tpd of up to 570 mA cm(-2), HPPMS and dcMS deposition rates are equal. For I-Tpd greater than 570 mA cm(-2), optical emission spectroscopy shows a pronounced increase of the Cr+/Cr-0 signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed.

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