Morphology optimization of very thick 4H-SiC epitaxial layers

• Epitaxial growth of about 200 gm thick, low doped 4H-SiC layers grown on n-type 8 degrees off-axis Si-face substrates at growth rates around 100 mu m/h has been done in order to realize thick epitaxial layers with excellent morphology suitable for high power devices. The study was done in a hot wall chemical vapor deposition reactor without rotation. The growth of such thick layers required favorable pre-growth conditions and in-situ etch. The growth of 190 gm thick, low doped epitaxial layers with excellent morphology was possible when the C/Si ratio was below 0.9. A low C/Si ratio and a favorable in-situ etch are shown to be the key parameters to achieve 190 gm thick epitaxial layers with excellent morphology.

Nyckelord

CVD; Chloride-based; Thick epitaxial layer; Morphology

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