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Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process

Acharya, Sarthak (author)
Luleå tekniska universitet,EISLAB
Chouhan, Shailesh Singh (author)
Luleå tekniska universitet,EISLAB
Delsing, Jerker, 1957- (author)
Luleå tekniska universitet,EISLAB
 (creator_code:org_t)
International Microelectronics and Packaging Society (IMAPS), 2019
2019
English.
In: IMAPS 2019 NordPac Conference – Lyngby, Denmark. - : International Microelectronics and Packaging Society (IMAPS). ; , s. 17-20
  • Conference paper (peer-reviewed)
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Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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Elektroniksystem
Electronic Systems

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Luleå University of Technology

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