Packaging Induced Stresses in Embedded and Molded GaN Power Electronics Components

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Akbari, SaeedRISE,Smart hårdvara (författare)

Packaging Induced Stresses in Embedded and Molded GaN Power Electronics Components

Artikel/kapitelEngelska2023

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Institute of Electrical and Electronics Engineers Inc.2023
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LIBRIS-ID:oai:DiVA.org:ri-65629
https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-65629URI
https://doi.org/10.1109/EuroSimE56861.2023.10100830DOI

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Språk:engelska
Sammanfattning på:engelska

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Correspondence Address: S. Akbari; Rise Research Institutes of Sweden, Sweden; This project has received funding from European Union s Horizon 2020 research and innovation programme (UltimateGaN project, grant agreement No 826392). It was also supported by Future Power Electronics Project funded by the ICT- Sweden.
Residual stresses created during the packaging process can adversely affect the reliability of electronics components. We used incremental hole-drilling method, following the ASTM E 837-20 standard, to measure packaging induced residual stresses in discrete packages of power electronics components. For this purpose, we bonded a strain gauge on the surface of a Gallium Nitride (GaN) power component, drilled a hole through the thickness of the component in several incremental steps, recorded the relaxed strain data on the sample surface using the strain gauge, and finally calculated the residual stresses from the measured strain data. The recorded strains and the residual stresses are related by the compliance coefficients. For the hole drilling method in the isotropic materials, the compliance coefficients are calculated from the analytical solutions, and available in the ASTM standard. But for the orthotropic multilayered components typically found in microelectronics assemblies, numerical solutions are necessary. We developed a subroutine in ANSYS APDL to calculate the compliance coefficients of the hole drilling test in the molded and embedded power electronics components. This can extend the capability of the hole drilling method to determine residual stresses in more complex layered structures found in electronics.

Ämnesord och genrebeteckningar

TEKNIK OCH TEKNOLOGIER Maskinteknik Teknisk mekanik hsv//swe
ENGINEERING AND TECHNOLOGY Mechanical Engineering Applied Mechanics hsv//eng
ASTM standards
Elasticity
Gallium nitride
III-V semiconductors
Microelectronics
Strain
Strain gages
Structural design
Discrete package
Electronic component
Incremental hole drilling method
Packaging induced stress
Packaging process
Power components
Power electronic components
Strain data
Strain-gages
Residual stresses

Biuppslag (personer, institutioner, konferenser, titlar ...)

Holmberg, Jonas,1976-RISE,Tillverkningsprocesser(Swepub:ri)jonasho2@ri.se (författare)
Andersson, DagRISE,Smart hårdvara(Swepub:ri)dagan@ri.se (författare)
Mishra, MadhavRISE,Smart hårdvara(Swepub:ri)madhavmi@ri.se (författare)
Brinkfeldt, KlasRISE,Smart hårdvara(Swepub:ri)klasbr@ri.se (författare)
RISESmart hårdvara (creator_code:org_t)

Sammanhörande titlar

Ingår i:Int. Conf. Therm., Mech. Multi-Phys. Simul. Exp. Microelectron. Microsyst., EuroSimE: Institute of Electrical and Electronics Engineers Inc.

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Av författaren/redakt...: Akbari, Saeed; Holmberg, Jonas, ...; Andersson, Dag; Mishra, Madhav; Brinkfeldt, Klas

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TEKNIK OCH TEKNOLOGIER: TEKNIK OCH TEKNO ...; och Maskinteknik; och Teknisk mekanik

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