Thermal improvement of press-pack packages : Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip

• In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

interlayer

Molybdenum

packaging

press-pack

pressure dependence

Silicon Carbide

Silver

thermal contact resistance

Contact resistance

Presses (machine tools)

Substrates

Surface roughness

Thermal conductivity of solids

Different pressures

Molybdenum substrate

Press pack

Silicon carbide chips

Silver interlayers

Chip scale packages

Publikations- och innehållstyp

ref (ämneskategori)

kon (ämneskategori)