WFRF:(Enoksson P.)
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- Khan, MF (author)
Methods for characterization of wafer-level encapsulation applied on Si to LTCC Anodic bonding
- Article/chapterEnglish2010
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- 2010
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- LIBRIS-ID:oai:DiVA.org:ri-32075
- https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-32075URI
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- Language:English
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- Ghavanini, FA (author)
- Haasl, Sjoerd,1976- (author)
- Löfgren, L (author)
- Persson, KRISE,Acreo (author)
- Rusu, CRISE,Acreo (author)
- Schjälberg-Henriksen, K (author)
- Enoksson, P (author)
- RISEAcreo (creator_code:org_t)
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- In:J. Micromech. Microeng.20, s. 64020-
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