Simple method for quality factor estimation in resonating MEMS structures

• The quality factor of a packaged MEMS resonating structure depends on both the packaging pressure and the structure's proximity to the walls. This type of mechanical constraints, which causes energy dissipation from the structure to the surrounding air, are applicable for oscillating energy harvesters and should be considered in the design process. However, the modelling of energy losses or the measurements of their direct influence inside a packaged chip is not trivial. In this paper, a simple experimental method to quantify the energy loss in an oscillating MEMS structures due to the surrounding air is described together with preliminary results. The main advantage of the method is the ability to characterize the damping contributions under different vacuum and packaging conditions without requiring any packaging of the harvester chip or fabrication of multiple devices with different cavity depths. © Published under licence by IOP Publishing Ltd.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Samhällsbyggnadsteknik -- Husbyggnad (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Civil Engineering -- Building Technologies (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Energy conversion

Energy dissipation

Nanotechnology

Damping contribution

Energy Harvester

Experimental methods

Mechanical constraints

Multiple devices

Quality factor estimation

Quality factors

Resonating structures

Chip scale packages

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