Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints

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Akbari, SaaedRISE,IVF (author)

Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints

Article/chapterEnglish2019

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Elsevier BV,2019
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LIBRIS-ID:oai:DiVA.org:ri-37331
https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-37331URI
https://doi.org/10.1016/j.microrel.2019.01.006DOI

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Language:English
Summary in:English

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Subject category:ref swepub-contenttype
Subject category:art swepub-publicationtype

Notes

Funding details: VINNOVA, 2015-01420; Funding details: Swedish Insitute, SI; Funding text 1: This work has been conducted within the Swedish national project "Requirements, specification and verification of environmental protection and life of solder joints to components" supported by the Swedish Governmental Agency for Innovation Systems (Vinnova) under contract 2015-01420 .
Lead-free tin-based solder joints often have a single-grained structure with random orientation and highly anisotropic properties. These alloys are typically stiffer than lead-based solders, hence transfer more stress to printed circuit boards (PCBs) during thermal cycling. This may lead to cracking of the PCB laminate close to the solder joints, which could increase the PCB flexibility, alleviate strain on the solder joints, and thereby enhance the solder fatigue life. If this happens during accelerated thermal cycling it may result in overestimating the lifetime of solder joints in field conditions. In this study, the grain structure of SAC305 solder joints connecting ceramic resistors to PCBs was studied using polarized light microscopy and was found to be mostly single-grained. After thermal cycling, cracks were observed in the PCB under the solder joints. These cracks were likely formed at the early stages of thermal cycling prior to damage initiation in the solder. A finite element model incorporating temperature-dependant anisotropic thermal and mechanical properties of single-grained solder joints is developed to study these observations in detail. The model is able to predict the location of damage initiation in the PCB and the solder joints of ceramic resistors with reasonable accuracy. It also shows that the PCB cracks of even very small lengths may significantly reduce accumulated creep strain and creep work in the solder joints. The proposed model is also able to evaluate the influence of solder anisotropy on damage evolution in the neighbouring (opposite) solder joints of a ceramic resistor.

Subject headings and genre

Anisotropy of tin grains
Finite element modelling
Lead-free soldering
Passive components
PCB cracking
Anisotropy
Ceramic materials
Cracks
Creep
Electronics packaging
Finite element method
Mechanical properties
Microelectronics
Printed circuit boards
Resistors
Soldering
Thermal cycling
Accelerated thermal cycling
Microelectronic components
Printed circuit board (PCBs)
Thermal and mechanical properties
Thermal cycling reliability
Lead-free solders

Added entries (persons, corporate bodies, meetings, titles ...)

Lövberg, AndreasRISE,IVF(Swepub:ri)andreas.lovberg@swerea.se (author)
Tegehall, Per-ErikRISE,IVF(Swepub:ri)per-erik.tegehall@swerea.se (author)
Brinkfeldt, KlasRISE,IVF(Swepub:ri)klasbr@ri.se (author)
Andersson, DagRISE,IVF(Swepub:ri)dagan@ri.se (author)
RISEIVF (creator_code:org_t)

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In:Microelectronics and reliability: Elsevier BV93, s. 61-710026-27141872-941X

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By the author/editor: Akbari, Saaed; Lövberg, Andreas; Tegehall, Per-Er ...; Brinkfeldt, Klas; Andersson, Dag

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