Sökning: WFRF:(Fischer Andreas C.)
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Heterogeneous 3D in...
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Forsberg, FredrikKTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
(författare)
Heterogeneous 3D integration of 17 μm pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems
- Artikel/kapitelEngelska2013
Förlag, utgivningsår, omfång ...
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2013-03-06
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IOP Publishing,2013
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printrdacarrier
Nummerbeteckningar
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LIBRIS-ID:oai:DiVA.org:ri-49923
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https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-49923URI
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https://doi.org/10.1088/0960-1317/23/4/045017DOI
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-106201URI
Kompletterande språkuppgifter
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Språk:engelska
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Sammanfattning på:engelska
Ingår i deldatabas
Klassifikation
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Ämneskategori:ref swepub-contenttype
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Ämneskategori:art swepub-publicationtype
Anmärkningar
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QC 20130422. Updated from submitted to published.
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This paper reports on the realization of 17 μm × 17 μm pitch bolometer arrays for uncooled infrared imagers. Microbolometer arrays have been available in primarily defense applications since the mid-1980s and are typically based on deposited thin films on top of CMOS wafers that are surface-machined into sensor pixels. This paper instead focuses on the heterogeneous integration of monocrystalline Si/SiGe quantum-well-based thermistor material in a CMOS-compliant process using adhesive wafer bonding. The high-quality monocrystalline thermistor material opens up for potentially lower noise compared to commercially available uncooled microbolometer arrays together with a competitive temperature coefficient of resistance (TCR). Characterized bolometers had a TCR of -2.9% K-1 in vacuum, measured thermal conductances around 5 × 10-8 W K-1 and thermal time constants between 4.9 and 8.5 ms, depending on the design. Complications in the fabrication of stress-free bolometer legs and low-noise contacts are discussed and analyzed.
Ämnesord och genrebeteckningar
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Adhesive wafer bonding
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Heterogeneous integration
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Microbolometer arrays
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Temperature coefficient of resistance
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Thermal conductance
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Thermal time constants
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Thermistor materials
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Uncooled microbolometers
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Infrared detectors
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Infrared imaging
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Semiconductor quantum wells
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Temperature sensors
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Thermistors
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Bolometers
Biuppslag (personer, institutioner, konferenser, titlar ...)
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Fischer, Andreas C.,1982-KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden(Swepub:kth)u1pfkzjx
(författare)
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Roxhed, NiclasKTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden(Swepub:kth)u1k8t8gc
(författare)
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Samel, BjörnRISE,Acreo,Acreo AB
(författare)
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Ericsson, PerRISE,Acreo,Acreo AB
(författare)
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Stemme, GöranKTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden(Swepub:kth)u1oyebfq
(författare)
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Niklaus, FrankKTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden(Swepub:kth)u1bcu8r2
(författare)
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KTHMikro- och nanosystemteknik
(creator_code:org_t)
Sammanhörande titlar
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Ingår i:Journal of Micromechanics and Microengineering: IOP Publishing23:40960-13171361-6439
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