The path to 1Tb/s and beyond datacenter interconnect networks : Technologies, components, and subsystems

• Modern IoT and 5G applications are driving the growth of Internet traffic and impose stringent requirements to datacenter operators for keeping pace with the increasing bandwidth and low-latency demands. At the same time, datacenters suffer from increasing number of interconnections dictating the deployment of novel architectures and high-radix switches. The ratification of 400 GbE standard is driving the market of optical transceivers nevertheless, a technology upgrade will be soon necessary to meet the tremendous traffic growth. In this paper, we present the development of 800 Gb/s and 1Tb/s optical transceivers migrating to 100 Gbaud per lane and employing wafer-scale bonding of InP membranes and InP-DHBT electronics as well as advanced co-packaging schemes. The InP membrane platform is also exploited for the development of novel ultra-fast optical space switches based on a modular architecture design for scaling to large number of I/O ports. 

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)

Keyword

1Tb/s transceivers

co-packaged optics

datacenter interconnects

InP membranes

InPDHBT electronics

optical space switches

photonic integration

wafer-bonding

5G mobile communication systems

Fiber optic networks

III-V semiconductors

Indium phosphide

Network architecture

Optical switches

Semiconducting indium phosphide

Time switches

Transceivers

Wafer bonding

WSI circuits

Interconnect networks

Internet traffic

Modular architectures

Novel architecture

Optical space switch

Stringent requirement

Technology upgrade

Traffic growth

Optical transceivers

Publication and Content Type

ref (subject category)

kon (subject category)