Measuring Contact Mechanics Deformations Using DIC through a Transparent Medium

This paper describes the experimental methodology used to study the contact mechanics of a rigid, rough surface and a compliant, nominally flat surface using digital image correlation (DIC). The rough surface was produced by 3-D printing PMMA and the flat surface was produced with transparent PDMS (silicone rubber). The deformation of the speckled top surface (contact) of the PDMS was measured via DIC viewed through the transparent media. Four different PDMS formulations with moduli ranging from 64 to 2120 kPa were used in the experiment program to cover a wide range of modulus normalized loads. The deformation of the contact surface and depth of penetration versus normalized load were measured. The results were overlaid with previous measurements of contact area and complemented them extremely well. Additionally, it was shown that scaling laws associated with such contact mechanics problems extend many length scales.

TEKNIK OCH TEKNOLOGIER Materialteknik Metallurgi och metalliska material hsv//swe
ENGINEERING AND TECHNOLOGY Materials Engineering Metallurgy and Metallic Materials hsv//eng
Contact mechanics
Digital image correlation
Indentation
Transparent medium
Image analysis
Mechanics
Microchannels
Silicones
Strain measurement
Surface measurement
Contact surface
D. digital image correlation (DIC)
Digital image correlations
Experimental methodology
Measurements of
Transparent media
Deformation

Bennett, A. I. (författare)
Harris, Kathryn LUniversity of Florida, USA(Swepub:ri)kathrynha@ri.se (författare)
Ifju, P. G. (författare)
Angelini, T. E. (författare)
Sawyer, W. G. (författare)
University of Florida, USA (creator_code:org_t)

Ingår i:Experimental mechanics: Springer New York LLC57:9, s. 1445-14550014-48511741-2765

Av författaren/redakt...: Rohde, S. E.; Bennett, A. I.; Harris, Kathryn ...; Ifju, P. G.; Angelini, T. E.; Sawyer, W. G.

Om ämnet

TEKNIK OCH TEKNOLOGIER: TEKNIK OCH TEKNO ...; och Materialteknik; och Metallurgi och m ...

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