The effect of hot isostatic pressing on thermal conductivity of additively manufactured pure tungsten

The crack-healing behaviors and microstructure evolution of pure tungsten produced by laser powder bed fusion (LPBF) were studied and compared before and after post hot isostatic pressing (post-HIP) treatment. An average thermal conductivity of 133 W.m(-1).K-1 at room temperature (RT) was obtained after HIP, which was 16% higher than that of as-built sample (115 W.m(-1).K-1). Although the HIP process had little effect on density, it resulted in a large grain size of > 300 mu m accompanied by a decrease in dislocation density and crack healing, which led to a substantial improvement of thermal conductivity of pure tungsten. The positive correlation between relative density and thermal conductivity of as-built tungsten was reported.

Li, Kailun (author)
Wang, Yafei (author)
Xing, Leilei (author)
Yu, Chenfan (author)
Liu, Hailong (author)
Ma, Jing (author)
Liu, Wei (author)
Shen, ZhijianStockholms universitet,Institutionen för material- och miljökemi (MMK),Tsinghua University, China(Swepub:su)shen (author)
Stockholms universitetInstitutionen för material- och miljökemi (MMK) (creator_code:org_t)

In:International journal of refractory metals & hard materials: Elsevier BV870263-4368

By the author/editor: Chen, Jinhan; Li, Kailun; Wang, Yafei; Xing, Leilei; Yu, Chenfan; Liu, Hailong; show more...; Ma, Jing; Liu, Wei; Shen, Zhijian; show less...

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