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Search: (WFRF:(Harrison Tabitha A.)) hsvcat:3 > (2024) > Electroless Deposit...

  • Tian, LiangFuzhou University (author)

Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection

  • Article/chapterEnglish2022

Publisher, publication year, extent ...

  • 2022-10-04
  • American Chemical Society (ACS),2022

Numbers

  • LIBRIS-ID:oai:research.chalmers.se:789e0feb-9692-46b3-974f-5de956d75329
  • https://research.chalmers.se/publication/532669URI
  • https://doi.org/10.1021/acsaelm.2c00974DOI

Supplementary language notes

  • Language:English
  • Summary in:English

Part of subdatabase

Classification

  • Subject category:art swepub-publicationtype
  • Subject category:ref swepub-contenttype

Notes

  • We propose that electroless plating is a superb approach to preparing metallic bumps with an ultrafine pitch for the integration of a micro light-emitting diode (micro-LED). Electroless plating does not suffer from lift-off-related issues, which are ubiquitous in thermal evaporation. Besides, it can result in much more uniform bumps than electroplating because the bump height is not affected by the current distribution. This study reports ultrafine pitch Ni/Au bumps fabricated by electroless nickel immersion gold (ENIG) plating. Furthermore, cheap metals iron and nickel are selected to catalyze the electroless nickel process. The results indicate that uniform and consistent Ni/Au bumps can be obtained through the iron sheet and nickel layer method. Besides, no voids and impurities are found inside the bumps, which is beneficial for the following interconnection process. Moreover, the change in Ni bump height values with the electroless plating time is also provided.

Subject headings and genre

Added entries (persons, corporate bodies, meetings, titles ...)

  • Lin, ChangFuzhou University (author)
  • Pan, KuiFuzhou University (author)
  • Lu, YuFuzhou University (author)
  • Deng, LiyingFuzhou University (author)
  • Huang, ZhonghangFuzhou University (author)
  • Yang, TianxiFuzhou University (author)
  • Zhang, YongaiFuzhou University (author)
  • Sun, Jie,1977Chalmers tekniska högskola,Chalmers University of Technology,Fuzhou University(Swepub:cth)jiesu (author)
  • Yan, QunFuzhou University (author)
  • Fuzhou UniversityChalmers tekniska högskola (creator_code:org_t)

Related titles

  • In:ACS Applied Electronic Materials: American Chemical Society (ACS)4:10, s. 4966-49712637-6113

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