WFRF:(Ericson F)
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Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures
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- Greek, S (author)
- Uppsala universitet
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- Ericson, F (author)
- Uppsala universitet
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- Johansson, S (author)
- Uppsala universitet
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- (creator_code:org_t)
- IOP PUBLISHING LTD, 1999
- 1999
- English.
- In: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. - : IOP PUBLISHING LTD. - 0960-1317. ; 9:3, s. 245-251
- Journal article (other academic/artistic)
Abstract
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- Young's modulus and the fracture strength of thick polysilicon films were evaluated with surface micromachined test structures. The polysilicon films were deposited in an epitaxial reactor and were about 10.5 mu m thick. Four different processing schemes
Keyword
- TENSILE-STRENGTH; STRESS
Publication and Content Type
- vet (subject category)
- art (subject category)
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- Rump, A
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- Uppsala University
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