Very compact FTTH Diplexer design using advanced wafer level fabrication methods

• FTTH networks require implementing a diplexer at each user termination. According to most of the standards, this diplexer detects a download signal beam at 1.49ÎŒm and emits an upload signal beam at 1.31ÎŒm on the same single mode fibre. Both signals exhibit datarate speed below 2.5Gbps. Today, most of the diplexers are obtained by actively aligning a set of individual optoelectronic components and micro-optics. However, new manufacturing solutions satisfying very low cost and mass production capability requirements of this market would help to speed the massive spreading of this technology. In this paper, we present an original packaging design to manufacture Diplexer Optical Sub-Assembly for FTTH application. A dual photodiode is stacked over a VCSEL and detects both the download signal beam at 1.49ÎŒm passing through the laser and one part of the upload signal beam at 1.31ÎŒm for monitoring. To satisfy this approach, an innovative VCSEL has been designed to have a very high transmission at 1.49ÎŒm. All these components are mounted on a very small circuit board on glass including also integrated circuits such as transimpedance amplifier. So, the device combines advanced optoelectronic components and highly integrated Multi-Chip-Module on glass approach using collective wafer-level assembling technologies. For the single mode fibre optical coupling, active and passive alignment solutions are considered.

Ämnesord

NATURVETENSKAP  -- Fysik -- Den kondenserade materiens fysik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Condensed Matter Physics (hsv//eng)

Nyckelord

Diplexer

FTTH

Optical interconnects

Packaging

VCSEL

Amplifiers (electronic)

Architectural design

Chip scale packages

Computer networks

Differential amplifiers

Electronic equipment manufacture

Electronics industry

Glass

Integrated circuits

Manufacture

Metropolitan area networks

Microelectronics

Network protocols

Networks (circuits)

Optical design

Optics

Pulsed laser deposition

Single mode fibers

Standards

Surface emitting lasers

Technology

(OTDR) technology

Diplexers

Fiber-to-the-home (FTTH) application

Filber-to-the-home (FTTH) networks

High transmission

Highly integrated

Individual (PSS 544-7)

Low costs

Manufacturing solutions

Mass production

Micro-optics

Multi chip module (MCM)

Optical couplings

Optical Sub-Assembly (OSA)

Optoelectronic components

Packaging designs

Passive alignment

Signal beams

Single mode fibres

Trans-impedance amplifier (TIA)

Wafer level fabrication

Wafer levels

Multiplexing equipment

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