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An in-plane phase-f...
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Marengo, AlessandroPolytechnic University of Milan
(author)
An in-plane phase-field ductile fracture model for orthotropic paperboard material
- Article/chapterEnglish2024
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LIBRIS-ID:oai:lup.lub.lu.se:b76b0ee5-59db-4d04-9022-9b6b9b1a42b4
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https://lup.lub.lu.se/record/b76b0ee5-59db-4d04-9022-9b6b9b1a42b4URI
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https://doi.org/10.1016/j.ijsolstr.2024.112763DOI
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Language:English
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Summary in:English
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A phase-field ductile fracture formulation for orthotropic paperboard materials is proposed, based on an anisotropic, multi-surface elastoplastic model describing the in-plane behavior of paperboard. A variational statement for the finite-step elastoplastic problem is extended to include the variational description of Griffith-type brittle fracture by a phase-field gradient term. The interaction between plastic and fracture dissipation mechanisms is modeled by introducing a scalar modulation function, assuming plasticity driven damage growth. This function depends on a scalar measure of the plastic strain components in the material orthotropy frame. It modifies the fracture activation criterion in a non-variational fashion, resulting in a direction-dependent material strength against crack propagation. The model performance is assessed by comparing numerical simulations and experimental tests conducted in a climate-controlled laboratory.
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Perego, UmbertoPolytechnic University of Milan
(author)
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Borgqvist, EricTetra Pak AB(Swepub:lu)soli-ebi
(author)
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Tryding, JohanLund University,Lunds universitet,Hållfasthetslära,Institutionen för byggvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Solid Mechanics,Department of Construction Sciences,Departments at LTH,Faculty of Engineering, LTH,Tetra Pak AB(Swepub:lu)soli-jtg
(author)
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Ristinmaa, MattiLund University,Lunds universitet,Hållfasthetslära,Institutionen för byggvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,LTH profilområde: Nanovetenskap och halvledarteknologi,LTH profilområden,Solid Mechanics,Department of Construction Sciences,Departments at LTH,Faculty of Engineering, LTH,LTH Profile Area: Nanoscience and Semiconductor Technology,LTH Profile areas,Faculty of Engineering, LTH(Swepub:lu)hall-mri
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Polytechnic University of MilanTetra Pak AB
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In:International Journal of Solids and Structures2940020-7683
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