Enhancing mmWave On-Chip-Antennas Using In-Package Electromagnetic Bandgap Structures

• We propose a silicon on-Chip-in-Package antenna design featuring a simulated radiation efficiency of > 70% and an S11 matching better than −10 dB in the 112–125 GHz frequency range. High radiation performance is achieved by: (i) thinning the silicon substrate down to 100 μm through wafer-level grinding; (ii) embedding the IC in-between two PCBs, one of which forms an electromagnetic bandgap structure that attenuates the EM leakage inside the silicon substrate. Furthermore, since the die-embedding concept employs the gap-waveguide packaging technology, a universal contactless waveguide interconnect is realized between the IC and the radiating gap waveguide in the package. This will also enable modular antenna designs.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Rymd- och flygteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Aerospace Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Inbäddad systemteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Embedded Systems (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

on-chip antennas

Gap waveguide technology

millimeter-wave antennas

antenna-in-package

Publication and Content Type

kon (subject category)

ref (subject category)