Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

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Enmark, Markus,1991Chalmers tekniska högskola,Chalmers University of Technology (author)

Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

Article/chapterEnglish2022

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2022

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LIBRIS-ID:oai:research.chalmers.se:0e55057e-85b6-4c76-b86a-1ce04ae810c6
https://research.chalmers.se/publication/532381URI

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Language:English
Summary in:English

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SwePubSwePub

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Subject category:kon swepub-publicationtype
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Notes

Graphene-based products are gaining popularity in thermal management applications in high performance electronics systems. The ultra-high thermal conductivity of graphene together with its relatively low density makes it a suitable material for reaching high cooling capability in lightweight applications. An example of products that are starting to enter the market is graphene enhanced thermal interface materials (TIMs). Pristine graphene enhanced TIMs are well characterized and show high thermal conductivity and low thermal interface resistance. Before these TIMs can take the next step from being a niche product to reach high volume sales on the market, it needs to be proven that they have stable performance over time when conditioned and aged according to industry reliability standards. In this work, a set of customized test rigs was designed, and graphene enhanced TIMs of three different thicknesses were tested. The TIMs were compressed by 30% and then subjected to three different industry standard reliability tests; thermal aging, temperature cycling and damp heat. The thermal resistance was measured sequentially during each test to monitor change over time. The reliability tests are still ongoing and so far the tested graphene enhanced TIMs have stable performance over time with some observable trends for the different tests. At the current test time the maximum degradation in thermal resistance is 13%, measured after 511 cycles in the thermal cycling test. The used test method is deemed promising for reliability comparison and future requirement standardization on thermal pads.

Subject headings and genre

TEKNIK OCH TEKNOLOGIER Maskinteknik Produktionsteknik, arbetsvetenskap och ergonomi hsv//swe
ENGINEERING AND TECHNOLOGY Mechanical Engineering Production Engineering, Human Work Science and Ergonomics hsv//eng
TEKNIK OCH TEKNOLOGIER Materialteknik Bearbetnings-, yt- och fogningsteknik hsv//swe
ENGINEERING AND TECHNOLOGY Materials Engineering Manufacturing, Surface and Joining Technology hsv//eng
TEKNIK OCH TEKNOLOGIER Materialteknik Annan materialteknik hsv//swe
ENGINEERING AND TECHNOLOGY Materials Engineering Other Materials Engineering hsv//eng
TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Annan elektroteknik och elektronik hsv//swe
ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
NATURVETENSKAP Fysik Den kondenserade materiens fysik hsv//swe
NATURAL SCIENCES Physical Sciences Condensed Matter Physics hsv//eng
thermal interface material
reliability testing
electronics cooling
graphene

Added entries (persons, corporate bodies, meetings, titles ...)

Murugesan, MuraliSHT Smart High-Tech AB (author)
Nkansah, AmosSHT Smart High-Tech AB (author)
Fu, Yifeng,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)yifeng (author)
Nilsson, Torbjörn M.J.Saab AB,Saab (author)
Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
Chalmers tekniska högskolaSHT Smart High-Tech AB (creator_code:org_t)

Related titles

In:2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022

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ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Mechanical Engin ...; and Production Engin ...

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ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Materials Engine ...; and Other Materials ...

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By the university: Chalmers University of Technology

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