Substrate-Less Vertical Chip-to-Waveguide Transition for W-Band Array Antenna Integration

• This paper presents a vertical transition from a high permittivity GaAs MMIC to rectangular waveguide using bondwires as a coupling structure. The transition is advantageous for the direct integration of any off-the-shelf chip into a waveguide antenna since no modification of the GSG-pad or additional substrate is needed. An EBG structure consisting of pins is used for the packaging of the chip in order to avoid field propagation in undesired directions. The simulations results show that the reflection coefficient is lower than -10 dB and the average insertion loss is better than 0.5 dB from around 87 to 101 GHz (14% relative bandwidth).

Ämnesord

NATURVETENSKAP  -- Fysik -- Atom- och molekylfysik och optik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Atom and Molecular Physics and Optics (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

waveguide (WG) transition

integration

bondwire

gap waveguide

mm-wave

Monolithic Microwave Integrated Circuit (MMIC)

packaging

W-band

GaAs

Publikations- och innehållstyp

kon (ämneskategori)

ref (ämneskategori)