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Silicon-Integrated Hybrid-Cavity 850-nm VCSELs by Adhesive Bonding: Impact of Bonding Interface Thickness on Laser Performance
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- Haglund, Emanuel, 1988 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Kumari, Sulakshna (author)
- Universiteit Gent,Ghent university
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- Haglund, Erik, 1985 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Gustavsson, Johan, 1974 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Baets, Roel G. (author)
- Universiteit Gent,Ghent university
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- Roelkens, Gunther (author)
- Universiteit Gent,Ghent university
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- Larsson, Anders, 1957 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2017
- 2017
- English.
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In: IEEE Journal of Selected Topics in Quantum Electronics. - 1558-4542 .- 1077-260X. ; 23:6, s. 1700109-
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Abstract
Subject headings
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- The impact of bonding interface thickness on the performance of 850-nm silicon-integrated hybrid-cavity vertical-cavity surface-emitting lasers (HC-VCSELs) is investigated. The HC-VCSEL is constructed by attaching a III–V “half-VCSEL” to a dielectric distributed Bragg reflector on a Si substrate using ultrathin divinylsiloxane-bis-benzocyclobutene (DVS-BCB) adhesive bonding. The thickness of the bonding interface, defined by the DVS-BCB layer together with a thin SiO2 layer on the “half-VCSEL,” can be used to tailor the performance, for e.g., maximum output power or modulation speed at a certain temperature, or temperature-stable performance. Here, we demonstrate an optical output power of 2.3 and 0.9 mW, a modulation bandwidth of 10.0 and 6.4 GHz, and error-free data transmission up to 25 and 10 Gb/s at an ambient temperature of 25 and 85 °C, respectively. The thermal impedance is found to be unaffected by the bonding interface thickness.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)
Keyword
- Heterogeneous integration
- large signal modulation
- silicon photonics
- semiconductor lasers
- optical interconnects
- vertical-cavity surface-emitting laser (VCSEL)
- high-speed modulation
Publication and Content Type
- art (subject category)
- ref (subject category)
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