Search: id:"swepub:oai:research.chalmers.se:20d26d9b-ab0e-4631-9d58-4350f9455cb1" >
Nano-Thermal Interf...
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Xu, LiShanghai University
(author)
Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
- Article/chapterEnglish2008
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LIBRIS-ID:oai:research.chalmers.se:20d26d9b-ab0e-4631-9d58-4350f9455cb1
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ISBN:9781424427406
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https://research.chalmers.se/publication/82535URI
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https://doi.org/10.1109/ICEPT.2008.4607085DOI
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Language:English
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Summary in:English
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Subject category:kon swepub-publicationtype
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Subject category:ref swepub-contenttype
Notes
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Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
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Yue, CongShanghai University
(author)
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Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu
(author)
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Zhang, YanShanghai University
(author)
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Lu, XiuzhenShanghai University
(author)
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Cheng, Zhaonian,1942Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)zhaonian
(author)
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Shanghai UniversityChalmers tekniska högskola
(creator_code:org_t)
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In:2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 20089781424427406
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