SwePub
Sök i LIBRIS databas

  Extended search

WFRF:(Rosenberg Philip S.)
 

Search: WFRF:(Rosenberg Philip S.) > (2015-2019) > 3D integrated super...

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

3D integrated superconducting qubits

Rosenberg, D. (author)
MIT Lincoln Laboratory
Kim, D. (author)
MIT Lincoln Laboratory
Das, R. (author)
MIT Lincoln Laboratory
show more...
Yost, D. (author)
MIT Lincoln Laboratory
Gustavsson, S. (author)
Massachusetts Institute of Technology (MIT)
Hover, D. (author)
MIT Lincoln Laboratory
Krantz, Philip, 1984 (author)
Massachusetts Institute of Technology (MIT)
Melville, A. (author)
MIT Lincoln Laboratory
Racz, L. (author)
MIT Lincoln Laboratory
Samach, G. O. (author)
MIT Lincoln Laboratory
Weber, S.J. (author)
MIT Lincoln Laboratory
Yan, F. (author)
Massachusetts Institute of Technology (MIT)
Yoder, J.L. (author)
MIT Lincoln Laboratory
Kerman, A.J. (author)
MIT Lincoln Laboratory
Oliver, W. D. (author)
Massachusetts Institute of Technology (MIT)
show less...
 (creator_code:org_t)
2017-10-09
2017
English.
In: npj Quantum Information. - : Springer Science and Business Media LLC. - 2056-6387. ; 3
  • Journal article (peer-reviewed)
Abstract Subject headings
Close  
  • As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2, echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.

Subject headings

NATURVETENSKAP  -- Fysik -- Annan fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Other Physics Topics (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Nanoteknik -- Nanoteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Nano-technology -- Nano-technology (hsv//eng)

Publication and Content Type

art (subject category)
ref (subject category)

Find in a library

To the university's database

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Close

Copy and save the link in order to return to this view