WFRF:(Andersson Dag)
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Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components
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- Andersson, Cristina, 1969 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Andersson, Dag R. (author)
- Tegehall, Per-Erik (author)
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- 2004
- 2004
- English.
- In: Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE). ; May:10th to 12th, s. pp 455-464
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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