(WFRF:(Sun Peng 1979 )) srt2:(2008)
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The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
- Ju, Guo-Kui (author)
- Wei, Xi-cheng (author)
-
- Sun, Peng, 1979 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- 2008
- 2008
- English.
- In: Soldering and Surface Mount Technology. - 1758-6836 .- 0954-0911. ; 20:3, s. 4-10
- Journal article (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- ref (subject category)
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- Ju, Guo-Kui
- Wei, Xi-cheng
- Sun, Peng, 1979
- Liu, Johan, 1960
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- Chalmers University of Technology
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