Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

As the integrity of micro electronic devices improves, the heat power of chips is getting higher and higher. How to reduce the temperature of micro electronic devices effectively becomes more and more important. In this paper, a micro-channel cooler test system is set up. By measuring the temperature and pressure at inlet and outlet of the micro cooler and the average temperature of micro cooler bottom, the heat transfer performance of the copper based CNTs coated micro cooler is researched. The thermal resistance of copper and silicon based CNTs coated micro cooler are compared. It is shown that the copper based CNTs coated micro cooler has good thermal dissipation capacity than that of the Silicon based CNTs coated micro cooler.

He, J.Shanghai University (författare)
Wang, X.Shanghai University (författare)
Wang, J.Shanghai University (författare)
Li, Z.Shanghai University (författare)
Fu, Yifeng,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)yifeng (författare)
Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (författare)
Shanghai UniversityChalmers tekniska högskola (creator_code:org_t)

Ingår i:Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, s. 560-5639781457717680

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