Sökning: WFRF:(Gunnarsson Sten 1976)
> (2015-2019) >
Demonstration of +1...
Demonstration of +100-GHz Interconnects in eWLB Packaging Technology
-
- Hassona, Ahmed Adel, 1988 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- He, Zhongxia Simon, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Vassilev, Vessen, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
visa fler...
-
- Mariotti, Chiara (författare)
- Infineon Technologies AG
-
- Gunnarsson, Sten, 1976 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Dielacher, Franz (författare)
- Infineon Technologies AG
-
- Zirath, Herbert, 1955 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
visa färre...
-
(creator_code:org_t)
- 2019
- 2019
- Engelska.
-
Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:7, s. 1406-1414
- Relaterad länk:
-
https://research.cha...
-
visa fler...
-
https://doi.org/10.1...
-
https://research.cha...
-
visa färre...
Abstract
Ämnesord
Stäng
- This paper presents waveguide interconnects implemented in an embedded wafer level ball grid array (eWLB) packaging technology. The interconnects operate at D-band (110–170 GHz), hence are enabling the realization and commercialization of high-data-rate systems. The interconnects rely on implementing radiating structures on the technology’s redistribution layers instead of using conventional ball grid arrays for the transmission of the RF signal to/from the package. The interconnects interface with standard WR-6.5 waveguides. Moreover, they do not require any galvanic contacts with the waveguide. The interconnects achieve a measured insertion loss of 2.8 dB over a bandwidth of 33%. The adopted eWLB packaging technology is suitable for low-cost high-volume production and allows heterogeneous integration with other technologies. This paper proposes cost-effective high-performance interconnects for THz integration, thus addressing one of the main challenges facing systems operating beyond 100 GHz.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
Hitta via bibliotek
Till lärosätets databas