3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

• Cooling of microsystem electronic device is of great importance, according to increased heat dissipation based on Moore's law. Different solutions are proposed to overcome this issue. On-chip microchannel cooler implements micro-fabrication techniques to achieve large areas in small volume size by introducing micro channel CNT fins with smaller fin pitch. In this paper, a 3D model of this structure is simulated using computational fluid dynamics (CFD) in ANSYS® software, and effect of various parameters such as channel width and height is discussed to achieve an optimized cooling for this system.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

Computational fluid dynamics

Electronics cooling

Carbon nanotubes

Flip chip packaging

Publication and Content Type

kon (subject category)

ref (subject category)