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Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
- Sun, Peng (author)
-
- Andersson, Cristina, 1969 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- show more...
- Andersson, Dag R (author)
- Tegehall, Per-Erik (author)
- Shangguan, Dongkai (author)
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- (creator_code:org_t)
- 2006
- 2006
- English.
- In: Proceedings of the 2006 7th International Conference on Electronics Packaging Technology. ; , s. 760-767
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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