Thermo-Mechanical Simulations of SiC Power Modules with Single and Double Sided Cooling

Effectively removing dissipated heat from the switching devices enables a higher current carrying capability per chip area ratio, thus leading to smaller or fewer devices for a given power requirement specification. Further, the use of SiC based devices has proven to increase the efficiency of the system thereby reducing the dissipated heat. Thermal models have been used to compare SiC power modules. Single and double sided cooling have been simulated. The simulated maximum temperatures were 141 °C for the single sided version and 119.7 °C for the double sided version. In addition, the reliability of a single sided module and thermally induced plastic strains of a double sided module have been investigated. A local model of the wire bond interface to the transistor metallization shows a 30/00 maximum increase in plastic strain during the power cycle. Simulations of the creep strain rates in the die attach solder layer for a power cycling loads also shows a 30/00 increase in creep strain per cycle.

Edwards, Michael,1986Chalmers tekniska högskola,Chalmers University of Technology,Chalmers University of Technology, Sweden(Swepub:cth)micedw (författare)
Ottosson, JonasVolvo Group,Volvo Group Truck Technology, Sweden (författare)
Neumaier, KlausFairchild Semiconductor GmbH, Germany (författare)
Zschieschang, OlafFairchild Semiconductor GmbH, Germany (författare)
Otto, AlexanderFraunhofer-Institut fur Elektronische Nanosysteme,Fraunhofer ENAS, Germany (författare)
Kaulfersch, EberhardBerliner Nanotest und Design GmbH,Berliner Nanotest und Design GmbH, Germany (författare)
Andersson, DagRISE,IVF(Swepub:ri)dagan@ri.se (författare)
RISEIVF (creator_code:org_t)

Ingår i:16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015: Institute of Electrical and Electronics Engineers Inc., s. 1 - 797814799994919781479999507

Av författaren/redakt...: Brinkfeldt, Klas; Edwards, Michael ...; Ottosson, Jonas; Neumaier, Klaus; Zschieschang, Ol ...; Otto, Alexander; visa fler...; Kaulfersch, Eber ...; Andersson, Dag; visa färre...

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