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- Liu, Ya,1991Chalmers tekniska högskola,Chalmers University of Technology,Fudan University (author)
Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film
- Article/chapterEnglish2019
Publisher, publication year, extent ...
- 2019
Numbers
- LIBRIS-ID:oai:research.chalmers.se:802ac366-cd99-4982-b30a-d7c5d84d5a47
- https://doi.org/10.1109/THERMINIC.2019.8923441DOI
- https://research.chalmers.se/publication/517323URI
- https://research.chalmers.se/publication/515277URI
Supplementary language notes
- Language:English
- Summary in:English
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- SwePubSwePub
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Notes
- Hexagonal Boron Nitride (h-BN) has been considered as a promising enhancement filler for thermal management due to its high thermal conductivity, structural stability, and super electrical resistivity. Numerus studies have reported using BN as an enhancement filler to achieve high thermally conductive polymer based thermal management materials. However, there are limited data regarding the influence of the flake size of BN sheets to the thermal management property of BN filled composites. In this work, three h-BN size geometries, including microscale h-BN powder, h-BN nanosheets, and a mixture of micro and nanoscale h-BN, were studied regarding its thermal transfer performance. The results show that h-BN nanosheets are able to achieve the highest in-plane thermal conductivity with loading from 0 - 5 wt% while for the through-plane thermal conductivity, all three geometries show similar thermal property when the filler loading less than 5 wt%. Through-plane thermal conductivity exhibits a sudden increase to 5.69 W m-1 K-1 at a loading of 5 wt%..
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Materialteknik Keramteknik hsv//swe
- ENGINEERING AND TECHNOLOGY Materials Engineering Ceramics hsv//eng
- NATURVETENSKAP Kemi Materialkemi hsv//swe
- NATURAL SCIENCES Chemical Sciences Materials Chemistry hsv//eng
- TEKNIK OCH TEKNOLOGIER Materialteknik Kompositmaterial och -teknik hsv//swe
- ENGINEERING AND TECHNOLOGY Materials Engineering Composite Science and Engineering hsv//eng
- Conducting polymers
- Geometry
- III-V semiconductors
- Nanosheets
- thermally conductive
- Fillers
- Composite films
- Boron nitride
- Integrated circuits
Added entries (persons, corporate bodies, meetings, titles ...)
- Wang, NanSHT Smart High-Tech AB (author)
- Ye, L.SHT Smart High-Tech AB (author)
- Lu, HongbinFudan University (author)
- Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Chalmers tekniska högskolaFudan University (creator_code:org_t)
Related titles
- In:THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems
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