WFRF:(Liu Johan 1960)
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Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application
- Pinardi, Kuntjoro (author)
-
- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Vogel, Dietmar (author)
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- Kang, Yi Lan (author)
- Liu, Sheng (author)
- Haug, Ralf (author)
- Willander, Magnus (author)
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- (creator_code:org_t)
- 2000
- 2000
- English.
- In: IEEE CPMT Transactions, Part A. ; 23, s. 447-451
- Journal article (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- ref (subject category)
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- Chalmers University of Technology
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