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Performance Analysis of an Integrated Multi-Channel Power Amplifier Incorporating an IC-to-Waveguide Transition

Aljarosha, Alhassan, 1982 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Technische Universiteit Eindhoven,Eindhoven University of Technology
Kaul, Piyush (author)
Technische Universiteit Eindhoven,Eindhoven University of Technology
Smolders, A. B. (author)
Technische Universiteit Eindhoven,Eindhoven University of Technology
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Matters-Kammerer, Marion K. (author)
Technische Universiteit Eindhoven,Eindhoven University of Technology
Maaskant, Rob, 1978 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Technische Universiteit Eindhoven,Eindhoven University of Technology
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 (creator_code:org_t)
2021
2021
English.
In: 2021 15TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP). - 2164-3342.
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • This paper studies the power combiner efficiency of multiple Power Amplifier (PA) output signals that are combined within a low-loss contactless transition, intrinsically having low isolation characteristics. Since the PA performance is sensitive to load impedance variations, poor isolation may affect each PA performance, thereby reducing the overall power combiner efficiency. Load impedance variations can e.g. be due to process, supply-voltage and temperature variations. A four-way spatial power combiner (SPC) design is compared to an on-chip Wilkinson Power Combiner (WPC) implemented in 0.13 mu m SiGe BiCMOS technology incorporating a 50 Omega impedance matching network. The WPC occupies 84% more area than the non-isolating SPC. Moreover, the non-isolating SPC has an average efficiency 14% larger than the WPC. For physically realistic variations, simulated results show a sigma-variation of 2.81 mW in P-out and 0.87 % in PAE for the non-isolating SPC, and 2.34 mW in P-out and 0.45 % in PAE for the WPC (@1 dB compression).

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

system integration
spatial power combiner
Wilkinson power combiner
millimeter-wave integrated circuits
power amplifiers
PVT variations
power combining efficiency
waveguide transitions
Impedance matching

Publication and Content Type

kon (subject category)
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