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Development and Cha...
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Wang, Nan,1988Chalmers tekniska högskola,Chalmers University of Technology
(author)
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
- Article/chapterEnglish2016
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Numbers
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LIBRIS-ID:oai:research.chalmers.se:a0f1668c-186d-405d-b839-9d3bcbccc4b3
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ISBN:9781509014026
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https://research.chalmers.se/publication/248221URI
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https://doi.org/10.1109/ESTC.2016.7764682DOI
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Language:English
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Summary in:English
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In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal management of power devices. The developed G-TCA has many advantages, including high thermal conductivity, lower density, good dispensing ability. and cost effective. To fabricate G-TCAs. few-layer graphene was utilized as fillers to improve the thermal conductivity of the TCA. The graphene nanosheets were fabricated through a high-speed shear mixing process in a mixed solvent. Compared to many reported liquid exfoliation process, the graphene fabrication process shows many advantages, such as high process efficiency, mass production, low-cost, clean and safe process. G-TCA sample with a hybrid filler ratio of 73% Ag and 3% graphene shows the highest thermal conductivity of 8 W/m K, which is almost four times higher than reference TCAs. A Joule heating setup was built to simulate G-TCA's function in a real electronic component and demonstrate the superior heat dissipation properties of the G-TCAs. Viscosities of the G-TCA samples were regulated in an acceptable range of many dispensing processes to be able to make uniform and fine patterns. Therefore, the developed G-TCA could be widely used for thermal management of power devices and electronic packaging area to decrease their working temperatures and extend the lifetime of devices.
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Logothetis, Nikolaos,1983Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)niklog
(author)
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Mu, Wei,1985Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)weim
(author)
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Huang, S.Shanghai University
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Ye, L.SHT Smart High-Tech AB
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Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu
(author)
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Chalmers tekniska högskolaShanghai University
(creator_code:org_t)
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In:2016 6th Electronic System-Integration Technology Conference (Estc), s. Article no 7764682-9781509014026
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