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Plasma assisted low...
Plasma assisted low temperature wafer bonding: void formation in the oxide free interface
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- Amirfeiz, Petra, 1973 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Sanz-Velasco, Anke, 1971 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Bengtsson, Stefan, 1961 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2003
- 2003
- English.
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In: Proceedings of the 7th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France (2003).
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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