WFRF:(Wei Peng)
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- Chen, Si,1981Chalmers tekniska högskola,Chalmers University of Technology (author)
Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
- Article/chapterEnglish2006
Publisher, publication year, extent ...
- 2006
Numbers
- LIBRIS-ID:oai:research.chalmers.se:aeecb1be-c748-4ca8-97f7-4664763335bf
- https://research.chalmers.se/publication/85704URI
- https://research.chalmers.se/publication/23884URI
Supplementary language notes
- Language:English
Part of subdatabase
- SwePubSwePub
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Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik hsv//swe
- ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
- TEKNIK OCH TEKNOLOGIER Materialteknik Annan materialteknik hsv//swe
- ENGINEERING AND TECHNOLOGY Materials Engineering Other Materials Engineering hsv//eng
Added entries (persons, corporate bodies, meetings, titles ...)
- Sun, Peng (author)
- Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Wei, Xiecheng (author)
- Cheng, Zhaonian,1942 (author)
- Shangguan, Dongkai (author)
- Chalmers tekniska högskola (creator_code:org_t)
Related titles
- In:Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, s. 368-373
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