id:"swepub:oai:research.chalmers.se:ba4cbda7-b84d-4152-bb6f-d27a435c1994"
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- Hansson, Josef,1991Chalmers tekniska högskola,Chalmers University of Technology (author)
Novel nanostructured thermal interface materials: a review
- Article/chapterEnglish2018
Publisher, publication year, extent ...
- 2017-04-19
- Informa UK Limited,2018
Numbers
- LIBRIS-ID:oai:research.chalmers.se:ba4cbda7-b84d-4152-bb6f-d27a435c1994
- https://research.chalmers.se/publication/254372URI
- https://doi.org/10.1080/09506608.2017.1301014DOI
Supplementary language notes
- Language:English
- Summary in:English
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Notes
- The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Materialteknik hsv//swe
- ENGINEERING AND TECHNOLOGY Materials Engineering hsv//eng
- Thermal interface materials
- thermal management
Added entries (persons, corporate bodies, meetings, titles ...)
- Nilsson, Torbjörn M. J.,1962Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)tornilss (author)
- Ye, L.SHT Smart High-Tech AB (author)
- Liu, Johan,1960Shanghai University,Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Chalmers tekniska högskolaSHT Smart High-Tech AB (creator_code:org_t)
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- In:International Materials Reviews: Informa UK Limited63:1, s. 22-450950-66081743-2804
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