Novel nanostructured thermal interface materials: a review

• The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

Keyword

Thermal interface materials

thermal management

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