WFRF:(Liu Johan 1960)
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- Chen, Liu (author)
Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application
- Article/chapterEnglish2002
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- 2002
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- LIBRIS-ID:oai:research.chalmers.se:d4235c83-71f5-45b6-a6f0-0a3bda71a7e2
- https://research.chalmers.se/publication/85414URI
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- Language:English
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- Crinic, Midhat (author)
- Lai, Zonghe,1948Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)zonghe (author)
- Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Chalmers tekniska högskola (creator_code:org_t)
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- In:IEEE Transactions on Electronics Packaging Manufacturing25, s. 247-278
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