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Composite thermoele...
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Ma, Yi,1982Chalmers tekniska högskola,Chalmers University of Technology
(author)
Composite thermoelectric materials with embedded nanoparticles
- Article/chapterEnglish2013
Publisher, publication year, extent ...
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2012-11-13
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Springer Science and Business Media LLC,2013
Numbers
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LIBRIS-ID:oai:research.chalmers.se:ccd67964-79b1-4a71-a1e5-b9f850e4cf49
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https://research.chalmers.se/publication/173593URI
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https://doi.org/10.1007/s10853-012-6976-zDOI
Supplementary language notes
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Language:English
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Summary in:English
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Subject category:art swepub-publicationtype
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Subject category:ref swepub-contenttype
Notes
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The current status of the development of composite thermoelectric materials with embedded nanoparticles is reviewed. An introduction is given to the suggested mechanisms of improving thermoelectric properties by inclusions of nanoparticles and to experimental methods used to prepare such composites. The progress made in the development of thermoelectric materials with embedded nanoparticles is then covered, grouping the studies according to the optimal temperature range of operation of the materials investigated. Most studies have been devoted to materials within the medium temperature range, followed by low temperature materials, whereas high temperature materials have not yet received much attention within this area. In the majority of the materials systems studied, reports of improved thermoelectric performance upon introduction of nanoparticles in bulk thermoelectrics are found. However, for continued progress in this area, there is a need for systematic experimental studies that unambiguously correlate the resulting physical effects of the nanoinclusions to the measured materials properties.
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Heijl, Richard,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)kf03heri
(author)
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Palmqvist, Anders,1966Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)adde
(author)
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Chalmers tekniska högskola
(creator_code:org_t)
Related titles
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In:Journal of Materials Science: Springer Science and Business Media LLC48:7, s. 2767-27780022-24611573-4803
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