Experimental measurements for mechanical and electrical conductive properties of CNT bundles

• With the miniaturization and multifunction trend in consumer electronics and other numerous applications, the characteristic sizes of chips, components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase constantly. Carbon nanotube (CNT) has become a promising material due to its mechanical and conductive properties. In this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Nanoteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Nano-technology (hsv//eng)

NATURVETENSKAP  -- Biologi -- Bioinformatik och systembiologi (hsv//swe)

NATURAL SCIENCES  -- Biological Sciences -- Bioinformatics and Systems Biology (hsv//eng)

Keyword

Mechanical behavior

Carbon nanotubes

Mechanical and electrical

Consumer electronics

Heat flux

Heat flux densities

Silicon chip

Electrical conductivity

Characteristic size

Yarn

Conductive properties

Carbon

Flip chip interconnects

Publication and Content Type

kon (subject category)

ref (subject category)