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Mechanical and ther...
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Sun, Shuangxi,1986Chalmers tekniska högskola,Chalmers University of Technology
(author)
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
- Article/chapterEnglish2016
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LIBRIS-ID:oai:research.chalmers.se:d73b14b1-6083-4bea-87cd-5b23ae6e4841
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https://research.chalmers.se/publication/232670URI
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https://doi.org/10.1016/j.microrel.2015.10.028DOI
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Language:English
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Summary in:English
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Subject category:art swepub-publicationtype
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This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.
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Chen, Si,1981Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)sich
(author)
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Luo, Xin,1983Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)xinlu
(author)
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Fu, Yifeng,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)yifeng
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Ye, L.SHT Smart High-Tech AB
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Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu
(author)
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Chalmers tekniska högskolaSHT Smart High-Tech AB
(creator_code:org_t)
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In:Microelectronics and Reliability: Elsevier BV56, s. 129-1350026-2714
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Sun, Shuangxi, 1 ...
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Chen, Si, 1981
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Luo, Xin, 1983
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Fu, Yifeng, 1984
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Ye, L.
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Liu, Johan, 1960
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Nano technology
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Microelectronics ...
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Chalmers University of Technology