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Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications

Duan, Junmei (author)
Asplund, Johan (author)
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
 (creator_code:org_t)
2004
2004
English.
In: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). ; 04:EX905, s. pp 290-293
  • Conference paper (peer-reviewed)
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TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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Duan, Junmei
Asplund, Johan
Liu, Johan, 1960
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ENGINEERING AND TECHNOLOGY
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and Electrical Engin ...
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