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Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution

Bring, Martin, 1977 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Enoksson, Peter, 1957 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Sanz-Velasco, Anke, 1971 (author)
Chalmers tekniska högskola,Chalmers University of Technology
 (creator_code:org_t)
ISBN 9163192802
2006
2006
English.
In: proceeding of Eurosensors XX. - 9163192802
  • Conference paper (peer-reviewed)
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TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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