WFRF:(Xu Cheng)
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Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
- Lu, Xiuzhen (author)
- Xu, Li (author)
- Lai, Huaxiang (author)
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- Du, Xinyu (author)
- Cheng, Zhaonian, 1942 (author)
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- (creator_code:org_t)
- 2009
- 2009
- English.
- In: Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). ; , s. 1051-1053
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
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- ref (subject category)
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- Lu, Xiuzhen
- Xu, Li
- Lai, Huaxiang
- Du, Xinyu
- Liu, Johan, 1960
- Cheng, Zhaonian, ...
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- ENGINEERING AND TECHNOLOGY
- ENGINEERING AND ...
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- Chalmers University of Technology
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