Considerations of SiP based Antenna in Package/Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications

• Antenna-in-Package/Module (AiP/AiM) are the primary technologies to realize the RF subsystems for frequencies beyond millimeter-wave (mmW) bands, including sub-terahertz for potential B5G/6G applications. Due to the small wavelength, the mechanical process of the current system-in-package (SiP) results in limitations to realize antenna arrays at sub-terahertz. In this paper, the mechanical limits to cause radiation discrepancy is investigated by designing an AiP/AiM at 110 GHz band. Through the parametric studies based on the currently available cheap SiP process, one may summarize the considerations of AiP/AiM design for beyond sub-terahertz frequencies. The examination will consider the design of an 8x8 antenna array to provide a radiation gain of 20 dBi. Numerical full-wave simulations by HFSS were performed to obtain reliable behaviors of AiP/AiM radiations.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Rymd- och flygteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Aerospace Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Samhällsbyggnadsteknik -- Geoteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Civil Engineering -- Geotechnical Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

antenna-in-module

Sub-Terahertz frequencies

antenna-in-package

antenna array

Active antenna

B5G/6G mobile communication

Publication and Content Type

kon (subject category)

ref (subject category)