Sökning: WFRF:(Vassilev Vessen 1969)
> (2020-2024) >
D-band waveguide-to...
D-band waveguide-to-microstrip transition implemented in eWLB packaging technology
-
- Hassona, Ahmed Adel, 1988 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Vassilev, Vessen, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- He, Zhongxia Simon, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
visa fler...
-
- Uz Zaman, Ashraf, 1975 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Mariotti, C. (författare)
- Infineon Technologies AG
-
- Dielacher, F. (författare)
- Infineon Technologies AG
-
- Zirath, Herbert, 1955 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
-
visa färre...
-
(creator_code:org_t)
- 2020-02
- 2020
- Engelska.
-
Ingår i: Electronics Letters. - : Institution of Engineering and Technology (IET). - 1350-911X .- 0013-5194. ; 56:4, s. 187-
- Relaterad länk:
-
https://ietresearch....
-
visa fler...
-
https://research.cha...
-
https://research.cha...
-
https://doi.org/10.1...
-
visa färre...
Abstract
Ämnesord
Stäng
- This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution layers. The patch radiates to a WR-6.5 standard waveguide perpendicular to its plane. An electromagnetic band-gap structure realised by metal patches is used to suppress undesired modes and improve the performance of the transition. The proposed solution is experimentally verified, and measurement results show that the transition exhibits an average insertion loss of 2 dB across the frequency range 122-146 GHz which, to the best of the authors' knowledge, is the lowest reported loss for a D-band packaging solution in eWLB technology and hence addresses one of the main integration challenges facing millimetre-wave systems.
Ämnesord
- NATURVETENSKAP -- Fysik -- Annan fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences -- Other Physics Topics (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- NATURVETENSKAP -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences -- Condensed Matter Physics (hsv//eng)
Nyckelord
- WR-6
- eWLB packaging technology
- frequency range 122-146 GHz
- 0 GHz to 170
- 5 standard waveguide
- wafer level packaging
- 0 GHz
- 110-170 GHz
- 0 GHz
- interconnect
- frequency 122
- band waveguide-to-microstrip transition
- metal patches
- patch-radiator-based waveguide transition
- embedded wafer level ball grid array packaging technology
- electromagnetic band-gap structure
- patch radiates
- D-band packaging solution
- field effect MIMIC
- microstrip transitions
- eWLB technology
- ball grid arrays
- frequency 110
- 0 GHz to 146
- photonic band gap
- 0 dB
- noise figure 2
- waveguide transitions
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
Hitta via bibliotek
Till lärosätets databas